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An Indian Patent (555685) on “A Novel Corrugated Heat Sink with Hybrid Co-Filler Interfaced Microcapsules for Effective Thermal Management in Electronic Devices“ has been granted to Dr. Sudev Das, Ms. Aishwarya V of Department of Chemical Engineering
Dr. Sudev Das, Assistant Professor of Department of Chemical Engineering
Ms. Aishwarya V, Research Scholar - P190130CH, of Department of Chemical Engineering
